Applicable process：INC/UPC，DKC，DIC，BPC，ODF...
Applicable substrate size：All Size
Applicable substrate thickness：≥0.3mm
Cleaning method：UV/AP，DB/RB Brush，HP，BJ/SJ，HPMJ，MS，IR……
Equipment type：I Type，U Type，Line Type，Custom Made
Process indicators：Contact Angle
Particle Removal Rate
ESD Control
No Mura， No Roller Mark，No Contamination And No Scratch
Low Running Cost
